TDK expands its X2 safety film capacitor portfolio with the B3292xU/V series, targeting EMI suppression in industrial drives and automotive power electronics.
Kvaser announces Kvaser Edge, an open, secure Linux‑based edge computing platform that transforms how automotive and industrial teams collect, process, and act on data.
Toshiba introduces four voltage-driven photorelays in a compact S-VSON4T package, designed for high-temperature automotive semiconductor test and burn-in applications.
Renesas Electronics Corporation supplies R-Car V4H to Denso for Toyota’s RAV4 TSS(LSS) control unit, enabling integrated camera, radar and driver monitoring functions.
Dürr expands its application control portfolio with EcoAUC2, adding integrated cleaning control, extended colour capacity and multi-protocol connectivity for automated painting systems.
ADQ35 delivers dual-channel 5 GSPS sampling, 2.5 GHz bandwidth and GPU streaming up to 14 Gbyte/s for high-speed scientific and industrial data acquisition.
BMW Group advances Neue Klasse manufacturing at Plant Munich through digitally planned production systems, virtual validation, and pre-series assembly of a fully electric vehicle ahead of series launch.