21 {{ "2026-02-21T00:00:00+00:00" | date "MMM" }} '26

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Porsche News

Porsche brings four-digit performance from racetrack to electric SUV

Porsche unites heritage and electrification as the legendary Porsche 917/30 meets the new Porsche Cayenne Turbo Electric, the brand’s first production model to exceed 1,000 PS.

Read more…

20 {{ "2026-02-20T00:00:00+00:00" | date "MMM" }} '26

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Rohm Semiconductors News

Automotive MOSFET Packaging Targets Mounting Reliability

ROHM introduces a compact gull-wing package to support stable solder joints and high current handling in vehicle low-voltage power electronics.

Read more…

20 {{ "2026-02-20T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-02-20T00:00:00+00:00" | date "longDate" }}

Toyota News

Toyota Motor Europe Invests in Circular Factory in Poland

New 25,000 m² facility in Walbrzych will process 20,000 end-of-life vehicles annually, expanding Toyota’s circular economy operations in Europe.

Read more…

20 {{ "2026-02-20T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-02-20T00:00:00+00:00" | date "longDate" }}

Renesas News

High-performance 3nm system-on-chip technologies for automotive multi-domain control units

Renesas Electronics Corporation has developed advanced semiconductor technologies to enable secure, high-speed data processing and chiplet scalability for the next generation of software-defined vehicles.

Read more…

19 {{ "2026-02-19T00:00:00+00:00" | date "MMM" }} '26

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Continental News

Continental at Tire Technology Expo 2026

From March 3 to 5, 2026, in Hanover, the company is presenting tire innovations for self-driving vehicles and wear emission analysis to enhance safety and sustainability within the global automotive data ecosystem.

Read more…

19 {{ "2026-02-19T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-02-19T00:00:00+00:00" | date "longDate" }}

STMicroelectronics News

STMicroelectronics rolls out 60ns automotive isolated gate drivers

Fast 4A devices boost power density and safety in EV and industrial high-voltage designs.

Read more…

18 {{ "2026-02-18T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-02-18T00:00:00+00:00" | date "longDate" }}

HELLA News

Digital ADAS calibration platform expands connected workshop capabilities

Hella Gutmann Solutions launches the CSC-Tool PRO, a fully digital calibration system designed to improve precision, workflow automation, and data integration for advanced driver assistance systems.

Read more…

18 {{ "2026-02-18T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-02-18T00:00:00+00:00" | date "longDate" }}

Renesas News

Renesas Introduces 3nm TCAM for Automotive SoCs

Configurable 3nm FinFET TCAM achieves 5.27 Mb/mm² density, 0.167 fJ/bit search energy and enhanced functional safety for automotive and high-speed networking applications.

Read more…

17 {{ "2026-02-17T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-02-17T00:00:00+00:00" | date "longDate" }}

Seco Tools

Seco High Feed SP07 reduces inventories and maximizes productivity

Capable of handling a wide mix of materials, Seco High Feed SP07 excels in all machining strategies and allows you to push productivity levels, particularly on complex components.

Read more…

17 {{ "2026-02-17T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-02-17T00:00:00+00:00" | date "longDate" }}

Infineon News

Infineon supports zonal E/E architecture in Neue Klasse

Collaboration with BMW Group introduces centralized computing and software-defined vehicle functions for electrified platforms, integrating networking, control and power distribution layers.

Read more…

Technical Articles

Inductive Position Sensing: The Safety Backbone of Software-Defined Vehicles

Case studies

thyssenkrupp Automates Screwdriving with Universal Robots

Porsche brings four-digit performance from racetrack to electric SUV

Porsche unites heritage and electrification as the legendary Porsche 917/30 meets the new Porsche Cayenne Turbo Electric, the brand’s first production model to exceed 1,000 PS.

Automotive MOSFET Packaging Targets Mounting Reliability

ROHM introduces a compact gull-wing package to support stable solder joints and high current handling in vehicle low-voltage power electronics.

Toyota Motor Europe Invests in Circular Factory in Poland

New 25,000 m² facility in Walbrzych will process 20,000 end-of-life vehicles annually, expanding Toyota’s circular economy operations in Europe.

High-performance 3nm system-on-chip technologies for automotive multi-domain control units

Renesas Electronics Corporation has developed advanced semiconductor technologies to enable secure, high-speed data processing and chiplet scalability for the next generation of software-defined vehicles.

Continental at Tire Technology Expo 2026

From March 3 to 5, 2026, in Hanover, the company is presenting tire innovations for self-driving vehicles and wear emission analysis to enhance safety and sustainability within the global automotive data ecosystem.

STMicroelectronics rolls out 60ns automotive isolated gate drivers

Fast 4A devices boost power density and safety in EV and industrial high-voltage designs.

Digital ADAS calibration platform expands connected workshop capabilities

Hella Gutmann Solutions launches the CSC-Tool PRO, a fully digital calibration system designed to improve precision, workflow automation, and data integration for advanced driver assistance systems.

Renesas Introduces 3nm TCAM for Automotive SoCs

Configurable 3nm FinFET TCAM achieves 5.27 Mb/mm² density, 0.167 fJ/bit search energy and enhanced functional safety for automotive and high-speed networking applications.

Seco High Feed SP07 reduces inventories and maximizes productivity

Capable of handling a wide mix of materials, Seco High Feed SP07 excels in all machining strategies and allows you to push productivity levels, particularly on complex components.

Infineon supports zonal E/E architecture in Neue Klasse

Collaboration with BMW Group introduces centralized computing and software-defined vehicle functions for electrified platforms, integrating networking, control and power distribution layers.

International