06 {{ "2023-01-06T00:00:00+00:00" | date "MMM" }} '23

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Continental News

CONTINENTAL SHOWCASES CURVED DISPLAY WITH INVISIBLE CONTROL PANEL AND INNOVATION FOR DRIVER IDENTIFICATION

Technology company Continental will be presenting its Curved Ultrawide Display at CES 2023. “Ultrawide” refers to a width of 1.29 meters, curving from one A-pillar to the other. The 47.5 inch TFT display is illuminated by more than 3,000 LEDs on a 7,680 by 660 pixel active area.

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06 {{ "2023-01-06T00:00:00+00:00" | date "MMM" }} '23

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Harman News

Introducing HARMAN Ready Upgrade, Delivering Fast and Seamless In-Vehicle Hardware and Software Upgrades

HARMAN Ready Upgrade suite of products significantly lowers new feature time to market and cost for OEMs; empowers consumers to easily upgrade their own vehicle experiences.

Read more…

06 {{ "2023-01-06T00:00:00+00:00" | date "MMM" }} '23

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IAR Systems News

IAR Systems fully supports GigaDevice's automotive-grade MCUs

IAR Systems^®, world leader in software and services for embedded development, and GigaDevice, a leading supplier of semiconductor devices, jointly announce the extended support of the latest release of IAR Embedded Workbench for Arm^® 9.32.1 for GigaDevice’s GD32 MCU series.

Read more…

06 {{ "2023-01-06T00:00:00+00:00" | date "MMM" }} '23

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Infineon News

Infineon and Green Hills Software collaborate to deliver comprehensive automotive safety and security solutions for the TRAVEO T2G MCU families

Infineon Technologies AG and Green Hills Software, the worldwide leader in embedded safety and security, will provide a complete ecosystem for the development and deployment of advanced safety applications for the automotive industry.

Read more…

06 {{ "2023-01-06T00:00:00+00:00" | date "MMM" }} '23

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NXP News

NXP Introduces Advanced Automotive Radar One-Chip Family for Next-Gen ADAS and Autonomous Driving Systems

NXP Semiconductors, the market share leader in automotive radar according to Yole Intelligence, has announced a new industry-first 28nm RFCMOS radar one-chip IC family for next generation ADAS and autonomous driving systems.

Read more…

06 {{ "2023-01-06T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-01-06T00:00:00+00:00" | date "longDate" }}

ZF News

ZF AND US MOBILITY PROVIDER BEEP ARE PLANNING TO DELIVER SEVERAL THOUSAND NEW-GENERATION SHUTTLES

New shuttle generation celebrates world premiere at CES 2023. ZF and Beep plan to deliver several thousand new-generation autonomous Level 4 shuttles for the US market. With its autonomous transport system, technology group offers customers a comprehensive shuttle service concept including fleet management, maintenance, repairs and training.

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05 {{ "2023-01-05T00:00:00+00:00" | date "MMM" }} '23

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HELLA News

FLAT, EFFICIENT AND SCALABLE: HELLA BRINGS FLATLIGHT TECHNOLOGY INTO SERIES PRODUCTION AS DAYTIME RUNNING LIGHT FOR THE FIRST TIME

Lighting concept is successfully transferred from the rear combination lamp to an application in the front area; series production starts in 2025. FlatLight technology requires only five millimetres of installation space; implementation of daytime running light, direction indicator and position light in only one light element.

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05 {{ "2023-01-05T00:00:00+00:00" | date "MMM" }} '23

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Harman News

HARMAN Announces Ready Display, Transforming Consumer Electronics Display Experiences for the Vehicle

Patented Samsung technology from leading consumer devices has been reimagined for the vehicle to deliver new levels of vivid, brilliant in-cabin optics.

Read more…

05 {{ "2023-01-05T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-01-05T00:00:00+00:00" | date "longDate" }}

ONSEMI News

onsemi Silicon Carbide Power Module for Traction Inverters Selected for Hyundai Motor Group’s High Performance Electric Vehicles

Onsemi’s EliteSiC silicon carbide (SiC) modules increase the efficiency and lower the weight of the South Korean automaker’s traction inverters, extending electric vehicle (EV) range and improving performance.

Read more…

05 {{ "2023-01-05T00:00:00+00:00" | date "MMM" }} '23

Written on {{ "2023-01-05T00:00:00+00:00" | date "longDate" }}

NXP News

NXP’s New i.MX 95 Family of Applications Processors Delivers Safe, Secure and Scalable AI-enabled Edge Platforms

NXP Semiconductors has announced the i.MX 95 family, the newest addition to its i.MX 9 series of applications processors. The new i.MX 95 family combines high-performance compute, immersive Arm^® MaliTM-powered 3D graphics, an innovative new NXP accelerator for machine learning, and high-speed data processing.

Read more…

Market Overview

Southco Securing the EV: Charging and Grid Battery Storage Infrastructure

Technical Articles

ESSENTIAL VEHICLE SOFTWARE AND POWER ELECTRONICS IN BATTERY AND FUEL CELL ELECTRIC VEHICLES

CONTINENTAL SHOWCASES CURVED DISPLAY WITH INVISIBLE CONTROL PANEL AND INNOVATION FOR DRIVER IDENTIFICATION

Technology company Continental will be presenting its Curved Ultrawide Display at CES 2023. “Ultrawide” refers to a width of 1.29 meters, curving from one A-pillar to the other. The 47.5 inch TFT display is illuminated by more than 3,000 LEDs on a 7,680 by 660 pixel active area.

Introducing HARMAN Ready Upgrade, Delivering Fast and Seamless In-Vehicle Hardware and Software Upgrades

HARMAN Ready Upgrade suite of products significantly lowers new feature time to market and cost for OEMs; empowers consumers to easily upgrade their own vehicle experiences.

IAR Systems fully supports GigaDevice's automotive-grade MCUs

IAR Systems^®, world leader in software and services for embedded development, and GigaDevice, a leading supplier of semiconductor devices, jointly announce the extended support of the latest release of IAR Embedded Workbench for Arm^® 9.32.1 for GigaDevice’s GD32 MCU series.

Infineon and Green Hills Software collaborate to deliver comprehensive automotive safety and security solutions for the TRAVEO T2G MCU families

Infineon Technologies AG and Green Hills Software, the worldwide leader in embedded safety and security, will provide a complete ecosystem for the development and deployment of advanced safety applications for the automotive industry.

NXP Introduces Advanced Automotive Radar One-Chip Family for Next-Gen ADAS and Autonomous Driving Systems

NXP Semiconductors, the market share leader in automotive radar according to Yole Intelligence, has announced a new industry-first 28nm RFCMOS radar one-chip IC family for next generation ADAS and autonomous driving systems.

ZF AND US MOBILITY PROVIDER BEEP ARE PLANNING TO DELIVER SEVERAL THOUSAND NEW-GENERATION SHUTTLES

FLAT, EFFICIENT AND SCALABLE: HELLA BRINGS FLATLIGHT TECHNOLOGY INTO SERIES PRODUCTION AS DAYTIME RUNNING LIGHT FOR THE FIRST TIME

HARMAN Announces Ready Display, Transforming Consumer Electronics Display Experiences for the Vehicle

Patented Samsung technology from leading consumer devices has been reimagined for the vehicle to deliver new levels of vivid, brilliant in-cabin optics.

onsemi Silicon Carbide Power Module for Traction Inverters Selected for Hyundai Motor Group’s High Performance Electric Vehicles

Onsemi’s EliteSiC silicon carbide (SiC) modules increase the efficiency and lower the weight of the South Korean automaker’s traction inverters, extending electric vehicle (EV) range and improving performance.

NXP’s New i.MX 95 Family of Applications Processors Delivers Safe, Secure and Scalable AI-enabled Edge Platforms

International

Market Overview

Technical Articles

Technology company Continental will be presenting its Curved Ultrawide Display at CES 2023. “Ultrawide” refers to a width of 1.29 meters, curving from one A-pillar to the other. The 47.5 inch TFT display is illuminated by more than 3,000 LEDs on a 7,680 by 660 pixel active area.

HARMAN Ready Upgrade suite of products significantly lowers new feature time to market and cost for OEMs; empowers consumers to easily upgrade their own vehicle experiences.

IAR Systems®, world leader in software and services for embedded development, and GigaDevice, a leading supplier of semiconductor devices, jointly announce the extended support of the latest release of IAR Embedded Workbench for Arm® 9.32.1 for GigaDevice’s GD32 MCU series.

Infineon Technologies AG and Green Hills Software, the worldwide leader in embedded safety and security, will provide a complete ecosystem for the development and deployment of advanced safety applications for the automotive industry.

NXP Semiconductors, the market share leader in automotive radar according to Yole Intelligence, has announced a new industry-first 28nm RFCMOS radar one-chip IC family for next generation ADAS and autonomous driving systems.

Patented Samsung technology from leading consumer devices has been reimagined for the vehicle to deliver new levels of vivid, brilliant in-cabin optics.

Onsemi’s EliteSiC silicon carbide (SiC) modules increase the efficiency and lower the weight of the South Korean automaker’s traction inverters, extending electric vehicle (EV) range and improving performance.

International

IAR Systems^®, world leader in software and services for embedded development, and GigaDevice, a leading supplier of semiconductor devices, jointly announce the extended support of the latest release of IAR Embedded Workbench for Arm^® 9.32.1 for GigaDevice’s GD32 MCU series.