02
'21
Written on
ZF News
01
'21
Written on
Green HIlls News
Green Hills Software Expands Advanced Development Tools for Leading Global Automotive Tier 1 Suppliers Using Infineon TRAVEO II
Green Hills Software, the worldwide leader in embedded safety and security, has announced new capabilities that increase the productivity of software developers creating safety-sensitive automotive software when they use the MULTI® integrated development environment (IDE) and Green Hills Probe for the Infineon TRAVEO II processor.
01
'21
Written on
ONSEMI News
ON Semiconductor Is Going Virtual for embedded world 2021 DIGITAL
The online format for embedded world 2021 will enable ON Semiconductor to give engineers an unparalleled visitor experience.
01
'21
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IAR Systems News
IAR Systems adds Functional Safety certification for build tools for Linux
Streamlines Continuous Integration workflows from development to building and testing of applications with demands for Functional Safety certification.
01
'21
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Continental News
Start of Production in Debrecen, Hungary: Vitesco Technologies Further Expands Global Presence
After just two years of construction, the newest Vitesco Technologies plant in Debrecen, Hungary, went now into operation.
01
'21
Written on
Utac Ceram News
5G NETWORK UPGRADES
Dense Air and UTAC CERAM Millbrook Partner on the Sustainability of the 5G AutoAir Network. The network will be one of the first, and the largest standalone 5G neutral host networks in Europe.
01
'21
Written on
Ricardo News
Ricardo helps to launch Hydrogen Sussex to transform south coast into a national hub for green transport and energy
Leveraging Ricardo’s expertise in hydrogen, fuel cells and defossilised fuels to support zero emission mobility, the new energy group is dedicated to putting Sussex at the forefront of the hydrogen fuel revolution.
01
'21
Written on
EAO News
Enhanced protection. Fast mounting
Now also overmoulded with IP67 front and rear protection and integrated M12 connector.
26
'21
Written on
3D SYSTEMS News
3D Systems Announces Introduction of Next Generation ‘High Speed Fusion’ 3D Printing System for Aerospace and Automotive Market Applications
3D Systems (NYSE:DDD) today announced its introduction of a novel High Speed Fusion industrial 3D printer platform and material portfolio. Developed in a collaboration with Jabil Inc. (NYSE:JBL), this unique HSF TM family of products, including the Roadrunner TM 3D printer, is expected to provide the best economics of any high throughput industrial fused-filament offering in the market today.
26
'21
Written on
TDK News
