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TDK LAUNCHES NEW INDUCTORS FOR AUTOMOTIVE HIGH-FREQUENCY CIRCUITS

The high-frequency properties equal or superior to the conventional products are realized using an original internal structure developed by TDK.

TDK LAUNCHES NEW INDUCTORS FOR AUTOMOTIVE HIGH-FREQUENCY CIRCUITS

TDK Corporation has announced the introduction of its new MHQ1005075HA series of inductors for automotive high-frequency circuits. This product uses the same materials and construction methods as the conventional product, while applying TDK's proprietary design expertise to the internal structure from the perspective of fail-safe design. The series is 1005 size (1.0 × 0.5 × 0.7 mm - L x W x H), and the inductance ranges from 1.0 nH to 56 nH. Mass production of the product series began this month, February 2024.

Inductors for high-frequency circuits for automotive or infrastructure use must meet higher standards for safety and reliability, designed based on AEC-Q200.

The product leverages TDK's one-of-a-kind design expertise in the design of the internal structure to realize high-frequency properties equal or superior to conventional products. For example, the inductor’s internal structure is designed to reduce the chances of an open failure due to cracks in the mount points of the component. Combined with automotive circuit board manufacturing guidelines, the TDK MHQ1005075HA inductor can deliver a sizable increase of reliability in an automotive environment. TDK will further expand its line to meet the evolving needs of customers.

Main applications
  • High-frequency circuits for automotive equipment (transmitter-receiver circuitry for communications inside and outside the car, such as telematics and V2X)
  • High-frequency transmitter-receiver circuitry for radio communications of smartphones, tablets, base stations and other devices (used as a component for impedance matching or filter circuits)
Main features and benefits
  • The high-frequency properties equal or superior to the conventional products are realized using an original internal structure developed by TDK
  • High reliability and AEC-Q200-ready because its structure prevents break line problems caused by circuit board bending stress (automotive grade)

www.tdk.com

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