Automotive MOSFET Packaging Targets Mounting Reliability

Low-voltage power stages in vehicles depend on mechanically robust solder connections and predictable thermal behaviour as electrification expands across subsystems. Addressing these constraints, ROHM expanded its automotive 40 V/60 V MOSFET portfolio with devices built around the new HPLF5060 package.

Smaller footprint without sacrificing solder integrity
Automotive ECUs, pumps and lighting modules increasingly adopt compact PCB layouts, pushing MOSFET packages toward 5 × 6 mm class dimensions. Leadless formats reduce size but complicate inspection and solder reliability because of narrow terminal spacing.

The HPLF5060 package measures 4.9 mm × 6.0 mm and replaces the larger TO-252 outline (6.6 mm × 10.0 mm). Instead of a leadless structure, it uses gull-wing leads, enabling visible solder fillets and improving mounting reliability during automated assembly and in-field thermal cycling.

This design addresses a typical automotive reliability concern: solder joint fatigue under vibration and temperature swings across the −40 °C to +150 °C operating range common in vehicle power electronics.

Current capability shaped by internal interconnect
To maintain electrical performance despite the reduced footprint, the package integrates copper-clip junction technology. Compared with traditional wire bonding, a copper clip lowers electrical resistance and improves heat spreading between the die and leads.

In practice, this supports higher current density and reduces conduction losses in 12 V and 48 V vehicle architectures — typical environments for electric pumps, LED headlights and inverter control stages within the automotive data ecosystem of distributed electronic modules.

Production timeline and portfolio expansion
Mass production of MOSFETs using the HPLF5060 package began in November 2025, with distribution through component suppliers including DigiKey and Farnell.

ROHM also outlined additional packaging developments:

Together, these packages extend coverage from compact control circuits to higher-current power stages across automotive electrification subsystems.

www.rohm.com