10 {{ "2025-10-10T00:00:00+00:00" | date "MMM" }} '25

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Diodes Incorporated News

Diodes Incorporated Introduces Low-Power I2C/SPI-to-Dual-Channel UART Bridge for Enhanced Automotive Connectivity

The PI7C9X762Q delivers robust, energy-efficient communication for EVs, ADAS, and smart cockpit systems.

Read more…

09 {{ "2025-10-09T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-10-09T00:00:00+00:00" | date "longDate" }}

Melexis News

Melexis Launches Dual-Input Inductive Automotive Sensor

The MLX90514 IC simultaneously reads two coil sets, computing differential or vernier angles on-chip, reducing system complexity, enabling ASIL D compliance, and supporting compact, high-accuracy automotive designs.

Read more…

09 {{ "2025-10-09T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-10-09T00:00:00+00:00" | date "longDate" }}

ZF News

ZF Simplifies Software Updates for Bus and Coach OEMs

ZF’s Software Update Management System (SUMS) Service Suite enables bus OEMs to implement updates securely in compliance with UN/ECE R156.

Read more…

09 {{ "2025-10-09T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-10-09T00:00:00+00:00" | date "longDate" }}

FOBA News

FOBA presents new Y-Series at productronica 2025

FOBA presents the latest generation of its Y series at productronica 2025 in Munich from November 18 to 21. The Y.0202 and Y.0602 fiber lasers set new standards in precision, flexibility, and efficiency for industrial product marking.

Read more…

09 {{ "2025-10-09T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-10-09T00:00:00+00:00" | date "longDate" }}

BOSCH News

Bosch puts its first hydrogen truck into service in plant traffic

The 40-ton Bosch hydrogen truck, with a 200 kW fuel-cell system, converts H2 into electricity, offers an 800 km range, and holds 70 kg of H2 at 700 bar.

Read more…

09 {{ "2025-10-09T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-10-09T00:00:00+00:00" | date "longDate" }}

FORVIA News

FORVIA HELLA launches FlatLight technology as daytime running light

FORVIA HELLA’s innovative FlatLight for vehicle fronts reduces installation depth to 5 mm, is 80% lighter, 40% more energy-efficient, and offers maximum design freedom.

Read more…

09 {{ "2025-10-09T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-10-09T00:00:00+00:00" | date "longDate" }}

STMicroelectronics News

New automotive 8-channel gate driver delivers 48V mild-hybrid efficiency

Ready for 48V automotive power architectures, the L98GD8 driver from STMicroelectronics has eight fully configurable channels for driving MOSFETs in flexible high-side and low-side configurations.

Read more…

08 {{ "2025-10-08T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-10-08T00:00:00+00:00" | date "longDate" }}

Trumpf News

TRUMPF lasers make batteries safe and protect cars from rust

Lasers replace chemical processes to prepare adhesive bonds and coatings for electromobility and provide corrosion protection for aluminum components, ensuring greater sustainability.

Read more…

08 {{ "2025-10-08T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-10-08T00:00:00+00:00" | date "longDate" }}

Anritsu News

Anritsu Unveils First Hybrid eCall Evaluation Solution

Anritsu launched an industry-first evaluation solution for Hybrid eCall systems, ensuring reliable emergency calls by seamlessly integrating 4G (NG eCall) with legacy 2G/3G networks for automotive manufacturers.

Read more…

08 {{ "2025-10-08T00:00:00+00:00" | date "MMM" }} '25

Written on {{ "2025-10-08T00:00:00+00:00" | date "longDate" }}

Microchip News

Microchip Advances ASA-ML Interoperability for Open Automotive Connectivity

Multi-vendor ASA-ML chipsets now interoperate at up to 16 Gbps, enabling scalable, secure, and cost-efficient networking for ADAS and infotainment systems.

Read more…

Market Overview

How Racing Engineers Are Solving High-Pressure Hydrogen Storage

Technical Articles

Inductive Position Sensing: The Safety Backbone of Software-Defined Vehicles

Case studies

JSW Greentech adopts Siemens Xcelerator for commercial EV development

Diodes Incorporated Introduces Low-Power I2C/SPI-to-Dual-Channel UART Bridge for Enhanced Automotive Connectivity

The PI7C9X762Q delivers robust, energy-efficient communication for EVs, ADAS, and smart cockpit systems.

Melexis Launches Dual-Input Inductive Automotive Sensor

The MLX90514 IC simultaneously reads two coil sets, computing differential or vernier angles on-chip, reducing system complexity, enabling ASIL D compliance, and supporting compact, high-accuracy automotive designs.

ZF Simplifies Software Updates for Bus and Coach OEMs

ZF’s Software Update Management System (SUMS) Service Suite enables bus OEMs to implement updates securely in compliance with UN/ECE R156.

FOBA presents new Y-Series at productronica 2025

FOBA presents the latest generation of its Y series at productronica 2025 in Munich from November 18 to 21. The Y.0202 and Y.0602 fiber lasers set new standards in precision, flexibility, and efficiency for industrial product marking.

Bosch puts its first hydrogen truck into service in plant traffic

The 40-ton Bosch hydrogen truck, with a 200 kW fuel-cell system, converts H2 into electricity, offers an 800 km range, and holds 70 kg of H2 at 700 bar.

FORVIA HELLA launches FlatLight technology as daytime running light

FORVIA HELLA’s innovative FlatLight for vehicle fronts reduces installation depth to 5 mm, is 80% lighter, 40% more energy-efficient, and offers maximum design freedom.

New automotive 8-channel gate driver delivers 48V mild-hybrid efficiency

Ready for 48V automotive power architectures, the L98GD8 driver from STMicroelectronics has eight fully configurable channels for driving MOSFETs in flexible high-side and low-side configurations.

TRUMPF lasers make batteries safe and protect cars from rust

Lasers replace chemical processes to prepare adhesive bonds and coatings for electromobility and provide corrosion protection for aluminum components, ensuring greater sustainability.

Anritsu Unveils First Hybrid eCall Evaluation Solution

Anritsu launched an industry-first evaluation solution for Hybrid eCall systems, ensuring reliable emergency calls by seamlessly integrating 4G (NG eCall) with legacy 2G/3G networks for automotive manufacturers.

Microchip Advances ASA-ML Interoperability for Open Automotive Connectivity

Multi-vendor ASA-ML chipsets now interoperate at up to 16 Gbps, enabling scalable, secure, and cost-efficient networking for ADAS and infotainment systems.

International