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CCLINK News

CLPA highlights how TSN can turbocharge automotive manufacturing

As a Platinum sponsor of the Innovative Car Manufacturing (ICM) Summit 2022, the CC-Link Partner Association (CLPA) will showcase the benefits of Time-Sensitive Networking (TSN) technology for automotive manufacturing. Attendees to the ICM Summit, which will take place on 21st March, will be able to learn how TSN can advance their operations to drive up productivity and efficiency.

Continental News

FUEL EFFICIENCY MEETS HIGH MILEAGE: CONTI ECOREGIONAL GENERATION 3+ WITH REDUCED ROLLING RESISTANCE

Update to Conti EcoRegional range: innovative tread compounds and special production processes. With 3PMSF symbol indicating suitability for year-round use in all weather conditions. Conti EcoRegional HS3+ and Conti EcoRegional HD3+: excellent fuel efficiency helps to protect climate.

Rohm Semiconductors News

SiC MOSFETs from ROHM chosen by Lucid for efficient on-board charging of groundbreaking luxury electric vehicle

ROHM Semiconductor has announced that Lucid, an advanced luxury electric vehicle company headquartered in California, is using its silicon carbide metal-oxide-semiconductor field effect transistor (SiC MOSFET) in the ground-breaking Lucid Air.

ARNOLD UMFORMTECHNIK

New flow-hole forming screw extends application scope

The automotive industry is focusing on weight reduction. Thinner and higher-strength steels or aluminium are increasingly being used, and more and more designs use mixed materials. In this application context, new fasteners must ensure that joints are reliable.


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