07
'21
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TE Connectivity News
07
'21
Written on
ONSEMI News
ON Semiconductor Announces New Full Silicon Carbide MOSFET Module Solutions for Charging Electric Vehicles at APEC 2021
Comprehensive portfolio of wide bandgap devices for high-performance charging solutions.
04
'21
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Allisontransmission News
Allison Transmission Introduces xFE Transmissions for Medium-Duty Trucks
Fuel-saving, emissions-reducing transmission, proven worldwide on buses, now also offers truck operators an affordable stepping stone on the path towards electrification.
04
'21
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Micron News
Micron Accelerates Breakthrough Platform Innovation With Advancements Across Industry’s First 176-Layer NAND and 1-Alpha DRAM
Volume ramp of memory and storage portfolio additions power innovation across data center, intelligent vehicles and consumer devices.
04
'21
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Actia News
ACTIA BENEFITS FROM FRANCE RELANCE RECOVERY PLAN MEASURES FOR ITS CAAS-3 PROJECT AIMED AT ADDRESSING THE CHALLENGES OF THE AUTOMOTIVE INDUSTRY OF THE FUTURE
ACTIA is one of twelve new winners in the Occitanie region to receive funding to support the modernisation of the aviation and automotive industries.
04
'21
Written on
TE Connectivity News
TE Connectivity improves oil condition monitoring in heavy equipment and hydraulic systems with first-of-its-kind OPS3 multi-parametric oil quality sensor
OPS3 sensor provides top performance in harsh environments, simplifies manufacturing and scales the production capacity needed to meet increasing market demand.
03
'21
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Borgwarner News
BorgWarner to Supply Integrated Drive Module to Hyundai Motor Group Electric Vehicles
BorgWarner’s integrated drive module (iDM) was selected by the Hyundai Motor Group for its power electric system, which will be used in the upcoming A-segment electric vehicle production, planned to start in mid of 2023.
03
'21
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ST News
STMicroelectronics and Metalenz Partner to Transform Optical Sensing for Consumer, Automotive, and Industrial Applications
STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, and Metalenz Inc., the pioneer in meta-surface design and commercialization, today announced a co-development and license agreement that will see ST develop manufacturing processes for Metalenz’s meta-optics technology for next-generation smartphones, consumer devices, healthcare, and automotive applications.
03
'21
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Hexagon Manufacturing Intelligence News
Free Field Technologies and Autoneum collaborate to help OEMs accelerate the acoustic design of vehicles
New solution helps automakers mitigate noise and vibration through optimal use of acoustic treatments within Actran acoustic simulation software.
03
'21
Written on
SystemX News
