The exhibition will focus on Samsung’s advanced technologies, highlighting how they are driving new possibilities in diverse applications including HPC, server, data center, automotive and consumer electronics.

The 256GB AM9C1 boasts industry’s fastest speed, integrating advanced V-NAND technology, a 5nm controller and SLC mode option.

Samsung’s end-to-end semiconductor solutions for the rapidly evolving automotive market include advanced memory, powerful processors, safety-enhancing image sensors, and a wide portfolio of foundry technologies.

Samsung will demonstrate its automotive semiconductor solutions for future mobility at IAA MOBILITY 2023, to be held in Munich, Germany.

The new UFS 3.1 is optimized for IVI systems and consumes 33% less energy, providing added benefits to future automotive applications.

Built on a 10-core CPU design, the processor offers significant performance gains across the CPU, GPU and NPU, ensuring a safer and more captivating in-car experience.

Samsung Electronics has released its first ultra-wideband chipset, the Exynos Connect U100, with single-digit centimeter accuracy for use in mobile, automotive and IoT devices.

Ambarella's new CV3-AD685 System-on-Chip advances Autonomous and Advanced Driver Assistance System (ADAS) applications, providing a single-chip solution for multi-sensor fusion and path planning.

Samsung adds 5G connectivity with the Exynos Auto T5123, performance with the Exynos Auto V7 and reliability with the ASIL-B certified power management IC for automobiles.

ISOCELL Auto 4AC is a viewing camera sensor for surround view monitors or rear-view cameras in HD resolution.