Infineon Technologies AG a global semiconductor leader in power systems and IoT, will provide silicon carbide (SiC) power modules HybridPACK™ Drive G2 CoolSiC™ and bare die products to Xiaomi EV for its recently announced SU7 until 2027.
STMicroelectronics has introduced the ASM330LHBG1 automotive 3-axis accelerometer and 3-axis gyroscope module with a safety-software library that enables a cost-effective solution for functional-safety applications.
Volvo Trucks North America customer 4 Gen Logistics has deployed 41 Volvo VNR Electric trucks to haul freight throughout the Inland Empire and between the Port of Long Beach and distribution warehouses in the region.
With the introduction of the PSoC 4 High Voltage Precision Analog (HVPA)-144K microcontroller, Infineon Technologies AG addresses the automotive battery management sector by integrating high-precision analog and high-voltage subsystems on a single chip.
ZF Friedrichshafen AG, and Hon Hai Technology Group have completed the establishment of their joint venture in the field of passenger car chassis systems on April 30.
Diodes Incorporated introduces the PI3WVR14412Q, a 20Gbps 1:2 video switch for in-cabin infotainment and advanced driver assistance systems applications, featuring a space-saving design and temperature-sensing capabilities.
New ground-breaking functionality added to the Seco website allows customers to instantly compare inserts, enabling them to quickly discover and order Seco replacements that are equal to or better than their existing tools.