The third-generation silicon-carbide (SiC) MOSFET technology extends electric vehicle mileage in summer and winter, reduces total ownership cost.

The new product targets navigation assistance, telematics, theft prevention, and motion-activated functions for enhanced driving convenience, security, and comfort.

ST’s new STSAFE-V secure element has been chosen by indie Semiconductor for in-car charger reference design.

ACEPACK DMT-32 is the ST dual in-line, moulded, through-hole, 32-pin power module tailored for BEV/HEV automotive applications and suitable also for the industrial segment.

The TSB182 dual, low-power-consumption op amp can operate over an extended supply voltage operating range from 4 to 36 V and features rail-to-rail output.

The SPSB081 is a power management system IC providing electronic control modules with enhanced power management functionality.

The STMicroelectronics STPM801 is the market’s first automotive-qualified integrated hot-swap and ideal-diode controller featured for functional-safety applications.

The new iso-buck converter is ideal for protected power conversion and gate driving in IGBTs, SiC, and GaN transistors.

The ASM330LHB is an automotive inertial module with certified ASIL B software library, suitable for a broad range of automotive applications.

ST’s silicon carbide devices will be integrated in ZF’s future modular inverter platform, going into series production in 2025 in automotive sector.