IAV and Nexperia are collaborating to develop high-voltage topologies that replace decentralized power electronics with a unified system framework.

Semikron Danfoss and Nexperia explore semiconductor and packaging integration.

Nexperia introduced high-voltage wide-bandgap semiconductors featuring a surface-mount configuration designed to optimize thermal dissipation in power-dense systems.

AEC-Q101 qualified CCPAK1212 devices achieve 0.99 mΩ resistance, handle 460 A currents, cut PCB space by 40%, and boost thermal reliability for demanding 48 V automotive systems.

Nexperia has introduced the first 40 V to 100 V automotive MLPAK MOSFETs, offering enhanced power density and thermal performance for body control, infotainment, and lighting applications.

The NMUX27518 and NMUX27518-Q100 are the industry’s first multiplexers to operate from an extended 1.08 V to 3.63 V voltage range.

The new portfolio includes six automotive-qualified and six industrial-grade types, with VCEO ratings of 50 V, 80 V, and 100 V, and collector currents (IC) of 2 A, 3 A, and 8 A.

New products from Nexperia save space, cut costs and maintain signal integrity with ultra-low device capacitance even at higher data rates.

New D2PAK-7 packaged silicon carbide MOSFETs set industry benchmarks, delivering high performance and reliability for next-gen automotive power applications.

Nexperia unveils 16 automotive planar Schottky diodes in CFP2-HP packaging, offering low VF, efficient heat dissipation, and flexibility for automotive, industrial applications.