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Texas Instruments News
Texas Instruments Expands Automotive Semiconductors for Centralized ADAS & SDVs
The new portfolio targets centralized vehicle computing, radar perception, and in-vehicle networking, supporting software-defined architectures and higher automation levels across diverse automotive platforms.
www.ti.com
TI's innovations for advanced sensing, reliable in-vehicle networking and efficient, high-performance processing bring safer, more autonomous driving to all vehicle segments.
Automakers are increasingly consolidating vehicle electronics around centralized compute platforms to support advanced driver assistance systems and higher levels of autonomy. Texas Instruments has expanded its automotive portfolio with new system-on-chip, radar, and networking devices designed to support this architectural shift across entry-level to premium vehicles.
At the center of the portfolio expansion is the TDA5 family of high-performance computing SoCs, developed for safety-critical automotive applications. The family scales from 10 TOPS to 1200 TOPS of edge AI performance while maintaining power efficiency beyond 24 TOPS/W. This scalability allows OEMs to deploy different ADAS and autonomy feature sets across multiple vehicle models using a common hardware architecture.
The TDA5 SoCs integrate TI’s latest C7™ neural processing unit, delivering up to 12× higher AI performance than previous generations at similar power levels. This enables execution of large AI workloads, including transformer-based perception and decision models, without requiring additional thermal management hardware. The SoCs also integrate Arm® Cortex®-A720AE cores and support Automotive Safety Integrity Level D compliance through a safety-first architecture.
Chiplet-ready architecture and accelerated software development
The TDA5 family uses a chiplet-ready design based on Universal Chiplet Interconnect Express technology, allowing OEMs to adapt compute configurations while retaining a common platform. Cross-domain fusion capabilities allow ADAS, infotainment, and gateway workloads to be consolidated on a single device, reducing system complexity and cost.
To address software development challenges associated with software-defined vehicles, TI is collaborating with Synopsys to provide a Virtualizer™ development kit for TDA5 devices. The digital twin environment allows software teams to validate architectures and workloads earlier in development, with the potential to reduce time-to-market by up to 12 months.
Integrated 4D radar for higher-resolution perception
Radar remains a core sensing modality for automated driving due to its robustness in adverse weather and lighting conditions. TI’s AWR2188 4D imaging radar transceiver integrates eight transmit and eight receive channels into a single device, eliminating the need for cascaded radar configurations in many applications.
The single-chip architecture simplifies radar system design while enabling object detection beyond 350 m. Enhanced analog-to-digital conversion and chirp signal processing provide approximately 30% faster performance than previous solutions, supporting advanced use cases such as close-object discrimination, lost cargo detection, and high-dynamic-range environments.
Ethernet expansion to vehicle edge nodes
As vehicles transition to zonal and centralized electrical architectures, Ethernet is becoming the primary in-vehicle networking technology. TI’s DP83TD555J-Q1 10BASE-T1S Ethernet PHY extends Ethernet connectivity to edge nodes using a single twisted-pair cable.
The device integrates a media access controller and supports nanosecond-level time synchronization, Power over Data Line, and deterministic communication. These capabilities enable OEMs to reduce wiring complexity while maintaining real-time communication between sensors, actuators, and centralized compute units.
Automotive technologies showcased at CES 2026
Texas Instruments is presenting these automotive technologies at CES 2026, held January 6–9 in Las Vegas, Nevada. Demonstrations are located in the Las Vegas Convention Center North Hall, meeting room N115, alongside additional exhibits covering mobility, energy infrastructure, robotics, and data center applications.
Availability
The TDA54 software development kit is currently available, with sampling of the first TDA5-Q1 device expected by the end of 2026. Preproduction quantities of the AWR2188 radar transceiver and DP83TD555J-Q1 Ethernet PHY are available upon request.
www.ti.com
Automakers are increasingly consolidating vehicle electronics around centralized compute platforms to support advanced driver assistance systems and higher levels of autonomy. Texas Instruments has expanded its automotive portfolio with new system-on-chip, radar, and networking devices designed to support this architectural shift across entry-level to premium vehicles.
At the center of the portfolio expansion is the TDA5 family of high-performance computing SoCs, developed for safety-critical automotive applications. The family scales from 10 TOPS to 1200 TOPS of edge AI performance while maintaining power efficiency beyond 24 TOPS/W. This scalability allows OEMs to deploy different ADAS and autonomy feature sets across multiple vehicle models using a common hardware architecture.
The TDA5 SoCs integrate TI’s latest C7™ neural processing unit, delivering up to 12× higher AI performance than previous generations at similar power levels. This enables execution of large AI workloads, including transformer-based perception and decision models, without requiring additional thermal management hardware. The SoCs also integrate Arm® Cortex®-A720AE cores and support Automotive Safety Integrity Level D compliance through a safety-first architecture.
Chiplet-ready architecture and accelerated software development
The TDA5 family uses a chiplet-ready design based on Universal Chiplet Interconnect Express technology, allowing OEMs to adapt compute configurations while retaining a common platform. Cross-domain fusion capabilities allow ADAS, infotainment, and gateway workloads to be consolidated on a single device, reducing system complexity and cost.
To address software development challenges associated with software-defined vehicles, TI is collaborating with Synopsys to provide a Virtualizer™ development kit for TDA5 devices. The digital twin environment allows software teams to validate architectures and workloads earlier in development, with the potential to reduce time-to-market by up to 12 months.
Integrated 4D radar for higher-resolution perception
Radar remains a core sensing modality for automated driving due to its robustness in adverse weather and lighting conditions. TI’s AWR2188 4D imaging radar transceiver integrates eight transmit and eight receive channels into a single device, eliminating the need for cascaded radar configurations in many applications.
The single-chip architecture simplifies radar system design while enabling object detection beyond 350 m. Enhanced analog-to-digital conversion and chirp signal processing provide approximately 30% faster performance than previous solutions, supporting advanced use cases such as close-object discrimination, lost cargo detection, and high-dynamic-range environments.
Ethernet expansion to vehicle edge nodes
As vehicles transition to zonal and centralized electrical architectures, Ethernet is becoming the primary in-vehicle networking technology. TI’s DP83TD555J-Q1 10BASE-T1S Ethernet PHY extends Ethernet connectivity to edge nodes using a single twisted-pair cable.
The device integrates a media access controller and supports nanosecond-level time synchronization, Power over Data Line, and deterministic communication. These capabilities enable OEMs to reduce wiring complexity while maintaining real-time communication between sensors, actuators, and centralized compute units.
Automotive technologies showcased at CES 2026
Texas Instruments is presenting these automotive technologies at CES 2026, held January 6–9 in Las Vegas, Nevada. Demonstrations are located in the Las Vegas Convention Center North Hall, meeting room N115, alongside additional exhibits covering mobility, energy infrastructure, robotics, and data center applications.
Availability
The TDA54 software development kit is currently available, with sampling of the first TDA5-Q1 device expected by the end of 2026. Preproduction quantities of the AWR2188 radar transceiver and DP83TD555J-Q1 Ethernet PHY are available upon request.
www.ti.com
